Updated on May 23th, 2011 by ADMIN
Project Overview
SEAL projects fact sheet_final.pdf
Objectives:- Developing a common strategy for key enabling technologies in the EU
- Strengthening the European process and metrology equipment industry
- Increase the chances for SMEs to get access to European and non-European IC makers
- Make use of the excellent European research infrastructure at Fraunhofer IISB, CEA, IMEC and ICN
- Continue the broad success of SEA-NET, an Integrated Project in FP6
- Stabilize and increase the participation of European equipment industry in EU FP VII, ENIAC, CATRENE and national programmes etc.
- Assessment of prototype equipment and novel enhancements to existing equipment, and their application to next generation semiconductor technologies and device architectures
- Main process themes include: EUV masks, cleaning front end und back end, lithography (optics and multi e-beam), low temperature oxidation, bonding of thin wafers, plasma immersion ion implantation
- Key metrology equipment: full wafer and multi column e-beam inspection, life time measurements, nano-topography, EDS/EDX, mass metrology, acoustic microscopy, overlay metrology
- Cross-cut R&D: equipment and process characterisation, equipment simulation, equipment automation, generic equipment topics and assessment, training